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Process capability and short delivery time
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Process capability:
The number of PCB layers to be completed The equipment capacity is 1-10 layers, and the actual production is 1-6 layers. The substrate type is mainly FR-4. The main suppliers are: Kingboard (KB), Jinan Guoji Processing thickness 0.40mm- 3.20mm finished table copper thickness 1 OZ 1.5OZ 2OZ 2.5OZ 3OZ hole copper thickness 18-35um maximum size 600mm*700mm minimum size 10mm*10mm minimum line width/line spacing 0.10mm/0.10mm minimum aperture & tolerance range 0.20mm±0.076 mm Minimum solder mask bridge 0.10mm Forming size tolerance Gong shape: ±0.13mm Die punch shape: ±0.10mm Board warpage single-sided: ≤1.0% double-sided: ≤0.70% Multi-layer: ≤0.50% Surface treatment process tin spray , nickel gold, OSP
Delivery ability level:
Single-sided double-sided four-layer six-layer sample 2 5 5-7 6 -8 Batch new single return single new single return single new single return single new single return single spray tin 4-6 3-5 7-9 6- 8 10-12 8-10 12-15 10-13 Immersion Gold 5-7 4-6 8-10 7-9 10-12 8-10 12-15 10-13 OSP 4-6 3-5 7-9 6 -8 10-12 8-10 12-15 10-13
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